es en


FIWARE, Internet of Things and Conectivity

Our technologies


A fully open platform to facilitate the creation of new applications on the Internet of the Future.

FI-WARE provides advanced Cloud capabilities based on the OpenStack open standard, on which a huge amount of generic enablers that facilitate the development of applications in multiple areas is additionally offered. The connection to the Internet of Things, the storage, access, processing, publication and analysis of both multimedia content as well as big scale data, the co-creation of applications and contents, the development of advanced user interfaces with 3D and augmented reality capabilities are examples of problems that will be easy to address using the FI-WARE platform.

The specifications of the FI-WARE platform are public and loyalty-free, facilitating the appearance of several suppliers and avoiding tiding entrepreneurs to one specific supplier.

If you want to know more about the platform, click here.

Orion Context Broker

Orion Context Broker is one of the most important components of FiWare. Having a NGSI9/10 implementation, you could manage context information and its availability. Using this ‘enabler’ you can register to context items and manage them through query and update commands. Besides, you can subscribe to the data captured by the sensors and, once the established conditions occur, you will receive a notification.

If you are developing a data and context scenario, using a broker is necessary. A component within the architecture that is capable to interface between the data producers (in this case the sensors) and the data consumers (such as the smart phone applications that benefit from the information provided by the sensors) is required. Orion Context Broker satisfies this functionalities on the FI-WARE architecture.

Besides of the Orion Context Broker, there are other related components that can be useful, such as the Cygnus or the Orion PEP Proxy.

For further information, visit the operation guide here.


Internet of Things

Temperature, acceleration sensors (in order to detect vibration or impacts), a magnetic switch (in doors and other moving objects) and humidity sensors detect the inflexion points or anomalies; and they communicate it through the desired channel.

It is about small chips connecting to networks (Wifi, LAN, WAN, PAN, LPWA, etc.) and sending data to a service in the cloud or a recipient that can transform them into information to be displayed in a user-friendly way.

Telefónica R&D is progressing in innovation areas on which there are already tangible results. An example of this is in the Industrial area of the Internet of things, where Thinking Things was recently introduced — stackable modules, like Lego pieces, that allow equipping objects with connectivity — and this will be expanded to major businesses to solve important and complex issues.

Imagination is the limit, the possibilities are countless, and the applications are always developing.

© 2015 Centro I+D Telefonica Chile - All rights reserved ┬ę